Cooler Q2 Intel 1700 - 2U Passive RoHS

item no.: A 2728

Product in stock

-- €

LGA 1851/1700

Recommend for Intel® Alder Lake S Processor

Copper base with aluminum stacked fins plus 4 heat pipes

Up to TDP 155W

Shin-Etsu 7762 Pre-printed

Disclaimer: All product specifications and product images are subject to change without notice

SPECIFICATIONS:

Application
CPU Socket	LGA 1851/1700
CPU	Recommend for Intel® Alder Lake S Processor
Solution	Passive Copper base with Heatpipes Heatsink for 2U Server & up
Technical Data
Overall dimension	90 x 90 x 66 mm
Weight	653.5g
Heat Sink
Material	Copper Base with Aluminum Stacked Fin plus 4 Heat Pipes
Fan
Thermal grease	Pre-Printed with SHIN-ETSU 7762