Application
Socket	LGA2011
CPU	Intel® Sandy Bridge EP/EX Processors (for Narrow ILM Mounting Only)
Technical Data
Overall dimension	106.0 x 80.0 x 64.0 mm
Weight	490 g
Heat Sink
Material	Aluminum Stacked Fin Soldered on Copper Base with Heatpipe Enhancement

1. for Narrow ILM Mounting Only, mounting pitch 56 x 94mm
2. Support CPU Power up to 135 Watts
3. Thermal Grease Pre-Printed.
4. RoHS Compliance
5. Backplate / Back Strips is not included

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